.
Apart from that, other basic necessity would be floor mat and pass-through or pass thru door. In the industry, flooring in various types are used depending upon the classification of the cleanroom. The contamination control flooring type functions to trap dust and debris from shoes and Vinyl flooring which has a sealed seams to prevent accumulation of contamination are two examples of flooring used in the industry. The flooring used in Class 10 would Mipolam. The pass through door is a openings with two doors or three if there is another room where personnel and material are passed through. It interlocked so that while a door is opened, the other door is locked. .
Fabrication process in general.
Most of the IC chips today are built with the material non-other than the silicon. They are built on a silicon wafers. It is a semiconductor in nature, which is when it is doped. These wafers are purified sand and the impurity is less than 0.0001%. .
The IC fabrication in the University and in industry.
Basically, the IC fabrication process used in the University and the industry is similar. The differences are mainly lies on the amount of production, the yield of the IC produced, performance and the level of testing and characterisation. The following are the details on the fabrication process.
Oxidation.
Silicon dioxide layer is produced on the surface of the wafer. It is a insulating layer which is grown by heating in an oxygen rich furnace at temperature of 1000c for four hours. This is known as 'wet oxidation'. In the University, there about four to five furnaces in the etch room which can accommodates an average of 3.0 inches oxide wafers. Students are bound to observe as the process is in operation. Everything is done manually. Things are pretty much different in the industry that involved in mass production where most of the things are pretty many automatics. Wafers with diameter doubled that one used in the University and they are an epitaxial-layered wafers.
